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Liquid Cooling

For cooling high-power, high-heat flux electronic components like computer microprocessors, lasers, power electronics, military equipment, medical equipment or power electronics when air cooled heat sinks are inadequate, liquid cold plates and pumped liquid cooling systems technology from Thermacore offer the cost-effective, reliable high performance you need.

liquid cooled cold plate technologyLiquid cooling has the ability to dissipate more heat than passive or other active cooling methods. Liquid cooling involves circulating a coolant (air, water, glycol/water mixtures, polyalphaolefin [PAO]) through a cold plate that collects heat from heat generating sources and then dissipates heat through a liquid-to-air heat exchanger or liquid-to-liquid heat exchanger.

Thermacore designs, develops and manufactures custom liquid cooling components (cold plates) and complete self-contained pumped liquid cooling systems.

Liquid Cooled Cold Plates

Cold plate for liquid coolingThe key to liquid cooling thermal performance is Thermacore's proven cold plate technology. Thermacore’s custom liquid cooling component cold plates include tube-in-plate, aluminum vacuum-brazed and copper brazed types for various applications. Tube-in-plate cold plate materials consist of copper or stainless steel tubes pressed into a channeled aluminum or copper extrusion or machined plate. Aluminum vacuum-brazed cold plates are constructed from aluminum and can include embedded heat pipes for enhanced performance. Finally, designers can choose from a vertical fin cold plate (e.g. micro-channel technology) or — for the highest performance in truly demanding applications — a high-performance powdered metal cold plate.

Liquid Cooling System

Liquid Thermal Management System

Thermacore also designs, develops and manufactures custom pumped liquid systems to cool high-power semiconductors requiring high rates of heat removal with low fluid flow. Thermacore’s custom liquid-cooled assemblies are designed specifically to the customer’s unique thermal/mechanical requirements. Thermacore has designed these systems for aircraft, naval and computer applications. For computer applications, Thermacore’s Liquid Cooling System (LCS) is a sealed system that utilizes pumped single phase liquid to cool computer microprocessors. The liquid cooling system uses a pump to circulate a thermally-conductive liquid that removes heat from the processor using Thermacore’s Liquid Cold Plate technology and rejects it to the ambient air flowing through a liquid-to-air heat exchanger. Thermacore has incorporated its patented sintered powder metal technology into the cold plate component. Microchannel cold plates can be used for applications with lower performance requirements. The all-aluminum, liquid-to-air heat exchanger allows for higher heat flux capability to maximize heat transfer efficiency by dissipating excess microprocessor heat into the local ambient air.


 

Thermal management challenge? Take the first step towards the solution for you. Please contact a Thermacore technical representative or e-mail info@thermacore.com for more information on our thermal solution technologies.

 
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