Protect sensitive electronics from temperature fluctuations with heat spreading solutions from k Technology, Thermacore’s Division for advanced solid conduction systems.
k Technology k-Core thermal spreaders effectively extract heat from a surface opposite to an area of concentrated heat load. The resulting thermal spreading effect dissipates heat quickly and significantly reduces both peak temperatures and temperature change (∆T) compared with traditional aluminum designs. The result is increased chip life and potentially higher-power operation.
k Technology k-Core® thermal spreaders also can offer a low coefficient of thermal expansion, making a high-resistance interface between chip and spreader unnecessary.
Compare the temperature change using a conventional aluminum heat spreader with that of a k-Core thermal solution.