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Conduction Heat Transfer Expertise from
k Technology

Advanced solid conduction concepts from k Technology are used in thermal applications all over the world.

Thermal SpreadersAmong its primary thermal solutions, k Technology developed the patented k-Core heat transfer system, which uses encapsulated graphite to help alleviate heat in high-power electronics for applications in aerospace, military and commercial applications. The k-Core material uses APG as an insert within an encapsulating structure. k-Core can be fabricated by employing most conventional thermal management materials as the encapsulant (e.g., aluminum and copper alloys, ceramics, and composites), as dictated by user need and application. Light in weight, the passive k-Core system is highly conductive thermally and offers designers the ability to tailor coefficients of thermal expansion (CTE) if needed. The k-Core heat transfer system is typically designed for a specific application by our experienced engineering team.

Because k-Core can be encapsulated in a wide range of conventional thermal management metals and materials, k-Core heat transfer products provide “drop-in” replacements for the solid metal conductors. As a result, thermal designers can significantly reduce their electronic component temperatures, thereby improving performance, reliability and greatly prolonging the life of your most valued electronics systems.

k Technology’s products are used in aerospace satellites, avionics and military aircraft such as the F-35, F-22 and F-16 fighter planes. k Technology thermal management products also cool high power density electronic packaging, power electronics and other applications requiring high-performance heat transfer.

The k-Core Product Line

  • Patented encapsulated APG material system has three times the conductivity (k) of copper with the mass of aluminum
  • APG graphite provides a high k path
  • Encapsulant sets the CTE and structural properties
  • Encapsulant material is selected to satisfy requirements
  • Drop-in replacement for conventional conduction solutions

Table 1 k-Core Material Properties with Various Encapsulant Materials


Material

Thermal Conductivity (W/mK)

Density (g/cm3)



Coefficient of Thermal Expansion (CTE)  (ppm/K)



Specific Conductivity  (conductivity/ density)

(W/m·K/g/cm3)

w/o APG insert

with k-Core

w/o APG insert

with k-Core

w/o APG insert

with

k-Core

Copper (OFHC)

390.0

1176.0

8.90

4.92

16.9

43.8

239.2

Beryllium

220.0

1108.0

1.80

2.08

13.5

122.2

533.7

Aluminum Beryllium (62% Be)

210.0

1104.0

2.10

2.20

13.9

100.0

502.7

Aluminum (6061)

180.0

1092.0

2.80

2.48

23.6

64.3`

441.0

AlSi (40% Si)

126.0

1070.4

2.53

2.37

15.0

49.8

452.0

Magnesium (AZM)

79.0

1051.6

1.80

2.08

27.3

43.9

506.6

Kovar

14.0

1025.6

8.40

4.72

5.9

1.7

217.5

Custom thermal management solutions tailored to specific user needs. From one-of-a-kind spacecraft components that satisfy specific and demanding requirements to the production of thousands of thermal cores and heat spreaders to a given specification, k Technology has the expertise and experience to solve your thermal management challenges.


 

Thermal management challenge? Take the first step towards the solution for you. Please contact a Thermacore technical representative or e-mail info@thermacore.com for more information on our thermal solution technologies.

 
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